Mabrurotin M, Suryadi A. Redesign of the Packaging Design of Tempe-Sagu Chips Products Based on Customer Preferences Using Kansei Engineering and the Kano Model. IIJSE [Internet]. 1Nov.2024 [cited 25Jul.2026];8(1):429-45. Available from: https://e-journal.uac.ac.id/index.php/iijse/article/view/5539